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SOLIDWORKS Flow Simulation Electronic Cooling Module

SOLIDWORKS Flow Simulation Electronic Cooling Module includes both analysis productivity capability and enhanced simulation functionality, giving designers and engineers a great tool-set to tackle the tough challenges of electronic packaging for PCB’s and electronic components.

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SOLIDWORKS Flow Simulation Electronic Cooling Module Includes

PCB THERMAL ANALYSIS
Enable the study of PCB to evaluate component placement, including the use of heat pipes.
ELECTRONIC MODEL LIBRARY
Expanded library of materials, fan curves, TECs, thermal pads, and two-resistor component models.
PCB GENERATORS
Derive bi-axial thermal conductivity values automatically from the PCB structure and the properties of the specified conductor and dielectric materials and determine the physical properties of multi-layer PCBs.
JOULE HEATING ANALYSIS
Predict the heat generated from electrical circuits by inputting current and voltage conditions.
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